IR6500 BGA Rework Station – 1250W USB Infrared Reballing / Reflow

BGA IR6500 Rework Station designed for soldering, repairing, and removing complex components (BGA, PBGA, CSP, EMI shields, video chips, processors, PC motherboards, and consoles). Upper and lower infrared heating with precise closed-loop control, ideal for lead-free repairs.

🔧 Operation & Technical Advantages

• Upper and Lower IR Heating: uniform PCB heating to limit thermal shock and prevent board deformation.
• Closed-Loop Control: sensors continuously measure temperature to compensate for heat loss and maintain a stable profile (±0.5% accuracy).
• 8 Ramp Phases + 8 Soak Phases: allows progressive thermal profiles suitable for lead-free soldering.
• 10 Storable Profiles: saved settings for different types of PCBs (motherboards, consoles, TVs…).
• Software via USB: control of the heating cycle, real-time visualization, analysis, and saving on PC.
• Integrated LED Lighting: improved visibility for chip alignment and BGA balls.
• Adjustable X-Y Support: precise PCB holding, prevents warping, and adapts to different formats.

🛠 Main Uses

• Reflow / Reballing of graphics chips (GPU, APU, chipsets)
• Repair of LCD TVs / T-Con boards / BGA power boards
• Removal of EMI shields without damaging traces
• Repair of PC motherboards, servers, NAS, consoles (PS5/PS4/Xbox/Switch)
• High-temperature lead-free soldering

📏 Technical Specifications

• Total power: 1250W (top 400W / bottom 800W)
• Top heater size: 80 × 80 mm
• Bottom heater size: 180 × 180 mm
• Compatible chip: ≤ 70 × 70 mm
• Compatible PCB: ≤ 400 × 305 mm
• Dimensions: 47.5 × 48 × 42 cm
• 220V (EU plug) or 110V (US plug)

📦 Package Contents

• 1 × BGA IR6500 Station
• 1 × Power Cord
• 1 × Temperature Sensor Wire
• 1 × Aluminum Foil Roll
• 1 × USB Cable
• 1 × Manual (English)